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Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

Kim, K.-S. / Kim, J.-H. / Lee, J.-K. / Jarng, S.-S.

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Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

Kim, K.-S. / Kim, J.-H. / Lee, J.-K. / Jarng, S.-S.

Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

Kim, K.-S. / Kim, J.-H. / Lee, J.-K. / Jarng, S.-S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

Contributors:

Kim, K.-S. (author) / Kim, J.-H. (author) / Lee, J.-K. (author) / Jarng, S.-S. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 16 ; 1753-1756

Publication date:

1997-01-01

Size:

4 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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