Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM
Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM
Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM
Lepper, M. (Autor:in) / Von Glasow, A. (Autor:in) / Piscevic, D. (Autor:in) / Schwarzer, R. A. (Autor:in)
MATERIALS SCIENCE FORUM ; 273/275 ; 573-578
01.01.1998
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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