Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards
Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards
Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards
Zhu, Q. (Autor:in) / Shrotriya, P. (Autor:in) / Sottos, N. R. (Autor:in) / Geubelle, P. H. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 63 ; 1971-1983
01.01.2003
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Viscoelastic response of woven composite substrates
British Library Online Contents | 2005
|Residual Stress Development during Relamination of Woven Composite Circuit Boards
British Library Online Contents | 2001
|British Library Online Contents | 2018
|British Library Online Contents | 1998
|Biodegradable Materials for Multilayer Transient Printed Circuit Boards
British Library Online Contents | 2014
|