Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
Zhang, Y. W. (Autor:in) / Bower, A. F. (Autor:in) / Xia, L. (Autor:in) / Shih, C. F. (Autor:in)
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS ; 47 ; 173-199
01.01.1999
27 pages
Aufsatz (Zeitschrift)
Englisch
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
A simulation of asymmetrical voids evolution induced by electromigration
| British Library Online Contents | 2000
Three-dimensional Monte Carlo simulations of electromigration in polycrystalline thin films
| British Library Online Contents | 2000
Three-dimensional model for electromigration induced evolution of flip chip solder joints
| British Library Online Contents | 2009
Three-dimensional stress-strain finite element analysis of high rockfill dam
| British Library Conference Proceedings | 1997
In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation
| British Library Online Contents | 1994