Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H. / Tsai, C. M. / Hu, Y. C. et al. | British Library Online Contents | 2005

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Y. C. / Lin, Y. H. / Kao, C. R. et al. | British Library Online Contents | 2003

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008