Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding

Lee, J. / Mayer, M. / Zhou, N. et al. | British Library Online Contents | 2008

Wire Bonding Tutorial: Advances in Bonding Technology

Qin, I. W. | British Library Online Contents | 2005

Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

Ding, Y. / Kim, J. K. / Tong, P. | British Library Online Contents | 2006

Wire Bonding in Optoelectronics

Levine, L. R. | British Library Online Contents | 2002

Blind wire bonding device

KIM SANG GON | Europäisches Patentamt | 2022