Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Lee, J. (Autor:in) / Mayer, M. (Autor:in) / Zhou, N. (Autor:in) / Persic, J. (Autor:in)
MATERIALS TRANSACTIONS ; 49 ; 2347-2353
01.01.2008
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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