Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Packaging and Integration of MEMS and Related Microsystems
Packaging and Integration of MEMS and Related Microsystems
Packaging and Integration of MEMS and Related Microsystems
Malshe, A. (Autor:in)
ADVANCING MICROELECTRONICS ; 27 ; 8
01.01.2000
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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MEMS & Associated Microsystems
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Fundamentals of Microsystems Packaging
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Microsystems Technology (MST) and MEMS Applications: An Overview
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Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
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