Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2002

The Metallization of Diamond Grits

Sung, J. C. / Hu, S. C. / Chang, Y. S. | British Library Online Contents | 2007

The Metallization of Diamond Grits

Sung, J. C. / Hu, S. C. / Chang, Y. S. | British Library Online Contents | 2007

Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

Wei, Z. / Chunqing, W. / Bohan, Y. | British Library Online Contents | 2006

Structural-Phase State of the Diamond-Matrix Transition Zone in Hard-Alloy Diamond-Containing Composites with Diffusion Metallization of Diamonds during Sintering with Impregnation

Sharin, P. P. / Akimova, M. P. / Yakovleva, S. P. | TIBKAT | 2019