Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003

Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging

Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2003

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Nah, J.-W. / Chen, K. / Tu, K. N. et al. | British Library Online Contents | 2007

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2010

Solder Bump Inspection Evaluating new flip chip designs

Asgari, R. / Romega-Thompson, V. | British Library Online Contents | 2002