Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation
Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation
Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation
Tai, H.-J. (Autor:in) / Wang, J. B. (Autor:in) / Chou, H.-L. (Autor:in)
POLYMER COMPOSITES ; 21 ; 953-959
01.01.2000
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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