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    Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation

    New search for: Tai, H.-J.
    New search for: Wang, J. B.
    New search for: Chou, H.-L.

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    Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation

    New search for: Tai, H.-J.
    New search for: Wang, J. B.
    New search for: Chou, H.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation

    New search for: Tai, H.-J.
    New search for: Wang, J. B.
    New search for: Chou, H.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation

    Contributors:

    Tai, H.-J. (author) / Wang, J. B. (author) / Chou, H.-L. (author)

    Published in:

    POLYMER COMPOSITES ; 21 ; 953-959

    Publication date:

    2000-01-01

    Size:

    7 pages

    ISSN:

    0272-8397

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.192

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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