Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Computer modeling of the coarsening process in tin-lead solders
Computer modeling of the coarsening process in tin-lead solders
Computer modeling of the coarsening process in tin-lead solders
Li, L. (Autor:in) / Muller, W. H. (Autor:in)
COMPUTATIONAL MATERIALS SCIENCE ; 21 ; 159-184
01.01.2001
26 pages
Aufsatz (Zeitschrift)
Englisch
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