Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Scheerschmidt, K. (Autor:in) / Conrad, D. (Autor:in) / Wang, Y. (Autor:in)
COMPUTATIONAL MATERIALS SCIENCE ; 22 ; 56-61
01.01.2001
6 pages
Aufsatz (Zeitschrift)
Englisch
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