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A platform for research: civil engineering, architecture and urbanism
Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding
Scheerschmidt, K. (author) / Conrad, D. (author) / Wang, Y. (author)
COMPUTATIONAL MATERIALS SCIENCE ; 22 ; 56-61
2001-01-01
6 pages
Article (Journal)
English
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