Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms
Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms
Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms
Tong, J. (Autor:in) / Martini, D. (Autor:in) / Magtoto, N. (Autor:in) / Pritchett, M. (Autor:in) / Kelber, J. (Autor:in)
APPLIED SURFACE SCIENCE ; 187 ; 253-260
01.01.2002
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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