Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms: Fid-Bau Portal

Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

Tong, J. / Martini, D. / Magtoto, N. / Pritchett, M. / Kelber, J.

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Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

Tong, J. / Martini, D. / Magtoto, N. / Pritchett, M. / Kelber, J.

Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

Tong, J. / Martini, D. / Magtoto, N. / Pritchett, M. / Kelber, J.

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Document information

Title:

Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

Contributors:

Tong, J. (author) / Martini, D. (author) / Magtoto, N. (author) / Pritchett, M. (author) / Kelber, J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 187 ; 253-260

Publication date:

2002-01-01

Size:

8 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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