Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
Cho, J.-Y. (Autor:in) / Szpunar, J. A. (Autor:in) / Lee, D. N.
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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