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Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
Wang, Yuechun (Autor:in) / Chen, Xiuhua (Autor:in) / Ma, Wenhui (Autor:in) / Shang, Yudong (Autor:in) / Lei, Zhengtao (Autor:in) / Xiang, Fuwei (Autor:in)
Applied surface science ; 396 ; 333-338
01.01.2017
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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