Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
Konishi, S. (Autor:in) / Moriyama, M. (Autor:in) / Murakami, M. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1624-1628
01.01.2002
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Self-Annealing Textures of Copper Damascene Interconnects
| British Library Online Contents | 2004
Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects
| British Library Online Contents | 2002
Annealing Textures of Thin Films and Copper Interconnects
| British Library Online Contents | 2005
Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
| British Library Online Contents | 2009