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Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
Nishiura, M. (Autor:in) / Nakayama, A. (Autor:in) / Sakatani, S. (Autor:in) / Kohara, Y. (Autor:in) / Uenishi, K. (Autor:in) / Kobayashi, K. F. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1802-1807
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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