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Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Andersson, C. (Autor:in) / Lai, Z. (Autor:in) / Liu, J. (Autor:in) / Jiang, H. (Autor:in) / Yu, Y. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 394 ; 20-27
01.01.2005
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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