Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Basaran, C. (Autor:in) / Tang, H. (Autor:in) / Dishong, T. (Autor:in) / Searls, D. (Autor:in)
ADVANCED PACKAGING ; 10 ; 17-26
01.01.2001
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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