A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Computer simulations of solder joint reliability tests Simulation offers speed and cost savings over thermal cycling
Basaran, C. (author) / Tang, H. (author) / Dishong, T. (author) / Searls, D. (author)
ADVANCED PACKAGING ; 10 ; 17-26
2001-01-01
10 pages
Article (Journal)
English
DDC:
658.564
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