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Review of methods to predict solder joint reliability under thermo-mechanical cycling
Review of methods to predict solder joint reliability under thermo-mechanical cycling
Review of methods to predict solder joint reliability under thermo-mechanical cycling
RIDOUT, S. (Autor:in) / BAILEY, C. (Autor:in)
FATIGUE AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES ; 30 ; 400-412
01.01.2007
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1123
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