Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Prediction of Mechanical Properties of Lead-free Solders Using Indentation Method
Prediction of Mechanical Properties of Lead-free Solders Using Indentation Method
Prediction of Mechanical Properties of Lead-free Solders Using Indentation Method
Miyamoto, A. (Autor:in) / Ogawa, T. (Autor:in) / Ohsawa, T. (Autor:in)
MATERIALS SCIENCE RESEARCH INTERNATIONAL ; 9 ; 16-22
01.01.2003
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Lead-free Solders in Microelectronics
British Library Online Contents | 2000
|British Library Online Contents | 2000
|Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders
British Library Online Contents | 2002
|A review of mechanical properties of lead-free solders for electronic packaging
British Library Online Contents | 2009
|Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation
British Library Online Contents | 2006
|