Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A review of mechanical properties of lead-free solders for electronic packaging
A review of mechanical properties of lead-free solders for electronic packaging
A review of mechanical properties of lead-free solders for electronic packaging
Ma, H. (Autor:in) / Suhling, J. C. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 44 ; 1141-1158
01.01.2009
18 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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