Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Mirpuri, K. (Autor:in) / Cho, J.-Y. (Autor:in) / Szpunar, J. (Autor:in)
MATERIALS SCIENCE FORUM ; 426/432 ; 3551-3556
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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