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A platform for research: civil engineering, architecture and urbanism
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Texture, Microstructure and Stress Investigations in 0.18 mum Damascene Cu Interconnect Lines
Mirpuri, K. (author) / Cho, J.-Y. (author) / Szpunar, J. (author)
MATERIALS SCIENCE FORUM ; 426/432 ; 3551-3556
2003-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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