Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Measurement of full-field curvature and geometrical instability of thin film-substrate systems through CGS interferometry
Measurement of full-field curvature and geometrical instability of thin film-substrate systems through CGS interferometry
Measurement of full-field curvature and geometrical instability of thin film-substrate systems through CGS interferometry
Park, T. S. (Autor:in) / Suresh, S. (Autor:in) / Rosakis, A. J. (Autor:in) / Ryu, J. (Autor:in)
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS ; 51 ; 2191-2211
01.01.2003
21 pages
Aufsatz (Zeitschrift)
Englisch
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Surface Residual Stress Measurement Using Curvature Interferometry
British Library Online Contents | 2006
|Residual Stress Measurement of Porous Silicon Thin Film by Substrate Curvature Method
British Library Online Contents | 2006
|Stress Measurement of Thin Films by Substrate Curvature Method
British Library Online Contents | 2003
|Study on Radius of Curvature Measurement System by Interferometry
British Library Online Contents | 2013
|Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution
British Library Online Contents | 2008
|