Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
Wen, Y. (Autor:in) / Basaran, C. (Autor:in)
MECHANICS OF MATERIALS ; 36 ; 369-385
01.01.2004
17 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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