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A platform for research: civil engineering, architecture and urbanism
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
Wen, Y. (author) / Basaran, C. (author)
MECHANICS OF MATERIALS ; 36 ; 369-385
2004-01-01
17 pages
Article (Journal)
English
DDC:
620.11
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