Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Sarihan, V. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 421 ; 109-117
01.01.2006
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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