Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Abdul, J. (Autor:in) / Guo, N. (Autor:in) / Du, H. (Autor:in) / Wong, B. S. (Autor:in) / Chan, K. C. (Autor:in)
EXPERIMENTAL MECHANICS ; 44 ; 113-120
01.01.2004
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1
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