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A platform for research: civil engineering, architecture and urbanism
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Non-destructive Evaluation of the Interface Between Silicon Dies and Copper Leadframes in Integrated Circuit Packaging
Abdul, J. (author) / Guo, N. (author) / Du, H. (author) / Wong, B. S. (author) / Chan, K. C. (author)
EXPERIMENTAL MECHANICS ; 44 ; 113-120
2004-01-01
8 pages
Article (Journal)
English
DDC:
620.1
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