Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea
The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea
The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea
Kao, Y. L. (Autor:in) / Tu, G. C. (Autor:in) / Huang, C. A. (Autor:in) / Chang, J. H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 382 ; 104-111
01.01.2004
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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