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    The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea

    New search for: Kao, Y. L.
    New search for: Tu, G. C.
    New search for: Huang, C. A.
    New search for: Chang, J. H.

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    The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea

    New search for: Kao, Y. L.
    New search for: Tu, G. C.
    New search for: Huang, C. A.
    New search for: Chang, J. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea

    New search for: Kao, Y. L.
    New search for: Tu, G. C.
    New search for: Huang, C. A.
    New search for: Chang, J. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea

    Contributors:

    Kao, Y. L. (author) / Tu, G. C. (author) / Huang, C. A. (author) / Chang, J. H. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 382 ; 104-111

    Publication date:

    2004-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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