Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation
Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation
Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation
He, Y. T. (Autor:in) / Zhang, G. Q. (Autor:in) / Li, F. (Autor:in) / Ernst, L. J. (Autor:in) / Zhang, J. (Autor:in) / Shen, W. P. / Xu, J. Q.
01.01.2004
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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