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Damage behavior of 200-nm thin copper films under cyclic loading
Damage behavior of 200-nm thin copper films under cyclic loading
Damage behavior of 200-nm thin copper films under cyclic loading
Zhang, G. P. (Autor:in) / Volkert, C. A. (Autor:in) / Schwaiger, R. (Autor:in) / Arzt, E. (Autor:in) / Kraft, O. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 201-207
01.01.2005
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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