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    Damage behavior of 200-nm thin copper films under cyclic loading

    New search for: Zhang, G. P.
    New search for: Volkert, C. A.
    New search for: Schwaiger, R.
    New search for: Arzt, E.
    New search for: Kraft, O.

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    Damage behavior of 200-nm thin copper films under cyclic loading

    New search for: Zhang, G. P.
    New search for: Volkert, C. A.
    New search for: Schwaiger, R.
    New search for: Arzt, E.
    New search for: Kraft, O.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Damage behavior of 200-nm thin copper films under cyclic loading

    New search for: Zhang, G. P.
    New search for: Volkert, C. A.
    New search for: Schwaiger, R.
    New search for: Arzt, E.
    New search for: Kraft, O.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Damage behavior of 200-nm thin copper films under cyclic loading

    Contributors:

    Zhang, G. P. (author) / Volkert, C. A. (author) / Schwaiger, R. (author) / Arzt, E. (author) / Kraft, O. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 201-207

    Publication date:

    2005-01-01

    Size:

    7 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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