Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microscopic Experimental Investigation on Shear Failure of Solder Joints
Microscopic Experimental Investigation on Shear Failure of Solder Joints
Microscopic Experimental Investigation on Shear Failure of Solder Joints
Lau, K. J. (Autor:in) / Tang, C. Y. (Autor:in) / Tse, P. C. (Autor:in) / Chow, C. L. (Autor:in) / Ng, S. P. (Autor:in) / Tsui, C. P. (Autor:in) / Rao, B. (Autor:in)
INTERNATIONAL JOURNAL OF FRACTURE ; 130 ; 617-634
01.01.2004
18 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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