Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Tensile and Shear Behavior of Alloyed SN-Pb Solder Joints
This study presents an investigation of three ternary additions to a near-eutectic Sn-Pb alloy: indium (In), bismuth (Bi), and antimony (Sb). The effects of these ternary additions on the microstructure and on the strength in tensile and shear loading conditions in a joint configuration were studied. 17 refs., 29 figs. (ERA citation 13:051606)
Tensile and Shear Behavior of Alloyed SN-Pb Solder Joints
This study presents an investigation of three ternary additions to a near-eutectic Sn-Pb alloy: indium (In), bismuth (Bi), and antimony (Sb). The effects of these ternary additions on the microstructure and on the strength in tensile and shear loading conditions in a joint configuration were studied. 17 refs., 29 figs. (ERA citation 13:051606)
Tensile and Shear Behavior of Alloyed SN-Pb Solder Joints
L. K. Quan (Autor:in)
1988
52 pages
Report
Keine Angabe
Englisch
Tensile fracture of tin-lead solder joints in copper
British Library Online Contents | 2004
|Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
British Library Online Contents | 2016
|Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
British Library Online Contents | 2016
|Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints
British Library Online Contents | 2016
|Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes
British Library Online Contents | 2014
|