Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
Jensen, G. (Autor:in)
ADVANCED PACKAGING ; 14 ; 23-25
01.01.2005
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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