Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS
Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS
Technologies for Microdevice Packaging Packaging Requirements for MEMS and MOEMS
Pelzer, R. (Autor:in) / Teomim, D. (Autor:in) / Perlberg, G. (Autor:in) / Dragoi, V. (Autor:in)
ADVANCED PACKAGING ; 13 ; 31-40
01.01.2004
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Optoelectronics Packaging & Micro-Optoelectromechanical Systems (MOEMS) Topical Workshop Program
British Library Online Contents | 2002
British Library Online Contents | 2005
|Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
British Library Online Contents | 2004
|Flip Chip Technologies and Their Applications in MEMS Packaging
British Library Online Contents | 2002
|British Library Online Contents | 2002
|