A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
3-D Design of Stacked Die and SiP Meeting Requirements of Complex Packaging Technologies
Jensen, G. (author)
ADVANCED PACKAGING ; 14 ; 23-25
2005-01-01
3 pages
Article (Journal)
English
DDC:
658.564
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