Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al
Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al
Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al
Tanaka, Y. (Autor:in) / Kajihara, M. (Autor:in) / Watanabe, Y. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 445-446 ; 355-363
01.01.2007
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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