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Effect of pH on ceria-silica interactions during chemical mechanical polishing
Effect of pH on ceria-silica interactions during chemical mechanical polishing
Effect of pH on ceria-silica interactions during chemical mechanical polishing
Abiade, J. T. (Autor:in) / Choi, W. (Autor:in) / Singh, R. K. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 1139-1145
01.01.2005
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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