Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Mita, M. (Autor:in) / Kajihara, M. (Autor:in) / Kurokawa, N. (Autor:in) / Sakamoto, K. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 403 ; 269-275
01.01.2005
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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