Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing
The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing
The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing
Tsai, H. J. (Autor:in) / Chang, C. C. (Autor:in) / Jeng, Y. R. (Autor:in) / Chen, S. L. (Autor:in) / Jywe, W. / Chen, C.-L. / Fan, K.-C. / Fung, R. F. / Hanson, S. G. / Hsieh, W.-H.
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing
British Library Online Contents | 2005
|British Library Online Contents | 2010
|Effects of particle size, polishing pad and contact pressure in free abrasive polishing
British Library Online Contents | 1996
|On material removal capability of abrasive particle in polishing process
British Library Online Contents | 2003
|On material removal capability of abrasive particle in polishing process
British Library Online Contents | 2003
|