Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Lee, H. T. (Autor:in) / Lee, Y. H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 419 ; 172-180
01.01.2006
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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